The Exynos 9 Series 9810 is a flagship chipset built on Samsung’s second-generation 10nm production node and will come with small tweaks compared to last year’s SoCs. It uses 10LPP (Low Power Plus) technology, which is said to improve speeds by about 10 percent and power efficiency by about 15 percent when compared to Samsung’s first-generation. The chipset also has a Gigabit LTE Cat. 18 modem with support for 6CA aggregation, which means it is capable of combining six carrier signals for speeds up to 1.2Gbps.
To put it up simply, the Exynos 9810 chipset is 20 percent faster than the predecessor found in the Samsung Galaxy S8 and Galaxy S8+. Samsung did not mention as to which devices might be powered by the Exynos 9810, but, if rumors are anything to go by, the 2018-flagships- Galaxy S9 and Galaxy S9+ will be powered by Exynos 9810 under the hood. The details about the chipset are scarce at the moment.
Samsung is widely expected to launch the Galaxy S9 and Galaxy S9+ next year as successors to this year’s Galaxy S8 and Galaxy S8+. We also expect S9-series to sport updated hardware. Samsung has now confirmed its next-gen flagship chipset Exynos 9810, which will most likely be powering the company’s next flagship smartphones.
The Exynos 9810 SoC was actually listed as one of the 36 devices at the CES 2018 Innovation Awards. Details mentioned about the chipset were brief, but based on the specifications listed you can expect it to power the Galaxy S9 next year. The chipset is built with 3rd-generation custom CPU cores and will come with upgraded GPU, possibly Mali G72. They will also be based on 2nd generation 10nm process.
Samsung’s next-gen chipset is also expected to use the company’s latest 1.2Gbps CAT.18 6CA LTE Modem. The modem combines 6 carriers, which Samsung says is an industry first for better connectivity performance. In addition to this, the chipset will likely support Samsung’s latest ISOCELL Slim 2X7, which is a 24-megapixel image sensor with 0.9-micron pixels. The South Korean giant says the small 0.9-micron pixel size will enable the 24-megapixel sensor to be housed inside a thinner camera module.